Archecircuit Double-sided PCB Immersion Gold for Digital Camera
Dimension: 230.30*144.00 mm
Number of layers: Double-sided
Plate thickness: 1.6mm
Plate: FR-4
Surface finish: Immersion Gold
Application: Digital camera
| Layer Count | 1-32 Layers |
| Material | FR-4 (Tg 135 / Tg140 / Tg155 / Tg170/ As you required) Aluminum Rogers / PTFE Teflon |
| Surface Finishing | HASL/OSP/Immersion Gold(FR4) HASL(Aluminum) |
| Printed Wiring: | Pattern Plating |
| Max. Dimension | 660×475mm |
| Min. Dimension | 5×5mm |
| Finished board thickness: | 0.2mm-3.0mm |
| Thickness Tolerance: ( Thickness≥1.0mm) | ± 10% |
| Thickness Tolerance: ( Thickness<1.0mm) | ± 0.1mm |
| Finished Outer Layer Copper | Double sided: 1 oz/2 oz/3 oz/4 oz Multilayer: 1 oz/2 oz |
| Finished Inner Layer Copper | 0.5 oz/1 oz/2 oz |
| Drill Hole Size | Double sided: 0.20mm – 6.30mm Multilayer: 0.15mm-6.3mm |
| Drill Hole Size Tolerance | Pad Hole: +0.13/-0.08mm Pressure Welding Hole: ±0.05mm |
| Blind/Buried Vias | Don’t support |
| Min. Via Hole Size/Diameter | 1 & 2 Layer: 0.3mm(Via hole size) / 0.5mm(Via diameter) Multi-Layer: 0.15mm(Via hole size) / 0.25mm(Via diameter) Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size Preferred Min. Via hole size: 0.2mm |
| Min. Plated Slots | 0.35mm |
| Min. Non-Plated Slots | 0.65mm |
| Plated Half-hole | Hole Size: ≧0.15mm Pad to Board Edge：≧1mm Min. Size of Board: 10*10mm |
| Min. Trace width and spacing(1 oz) | 0.075/0.075mm (3mil/3mil) |
| Min. Trace width and Spacing(2 oz) | 0.16/0.16mm (6.5mil/6.5mil) |
| Min. Trace width and Spacing(2.5 oz) | 0.20/0.20mm (8mil/8mil) |
| Min. Trace width and Spacing(3.5 oz) | 0.25/0.25mm (10mil/10mil) |
| Min. Trace width and Spacing(4.5 oz) | 0.30/0.30mm (12mil/12mil) |
| Trace Tolerance | ±20% |
| Pad to Track | ≧0.1mm (≧0.09mm BGA) |
| Min. Annular Ring （1 oz) | Double sided: 0.25mm preffered (Limit 0.18mm) Multilayer: 0.20mm preffered (Limit 0.15mm) |
| Min. Annular Ring （No copper) | 0.45mm |
| BGA | Pad diameter:≥0.25mm Spacing between line to pad: ≥0.1mm (Multilayer: ≥0.09mm) |
| Solder mask Color | green,purple, red, yellow, blue, white, and black. |
| Solder mask Opening/ Expansion | 0.05mm |
| Solder mask ink Thickness | ≧10um |
| Min. Solder Bridge Width | Double sided: 0.10mm(green) 0.13mm(black/white) Multilayer： 0.08mm(green) 0.13mm(black/white) |
| Min. Line Width | ≧0.15mm |
| Min. Text Height | ≧1mm |
| Pad To Silkscreen | ≧0.15mm |
| Routing | Trace to Outline: ≧0.3mm Tolerance: ±0.2mm(Once) ±0.1mm(Twice) |
| V-Cut | Trace to Outline: ≧0.4mm Tolerance: ±0.4mm (Board Thickness ≧0.6mm) |
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How Archecircuit PCBs work for Digital devices?
- Component Installation: Digital devices include various electronic components such as processors, memory chips, sensors, displays, buttons, and connectors. These components are mounted on the PCB, usually secured in place through methods like soldering.
- Interconnections: The PCB has copper traces (also known as traces or tracks) that connect these electronic components. These traces provide pathways for electrical currents, enabling the components to communicate and work together.
- Power Management: PCBs have power distribution traces to deliver electrical power to the components on the board. They ensure that the components receive the required voltage and current to operate.
- Signal Transmission: The PCB’s traces transmit digital signals, which represent the device’s operations and functions. For example, a processor can send image data to a display or receive user input from buttons.
- Timing and Synchronization: In some devices, the PCB’s traces may also transmit clock signals to ensure that various parts of the device work together at the same time. This is crucial for synchronized audio-video playback or data processing.
- Power Traces: Power traces on the PCB route power from sources like batteries or external power adapters to provide electrical energy to the device.
- User Interface: The PCB may include user interface elements such as buttons, touch sensors, LED indicators, and displays. These elements allow users to interact with the device.
- Processing and Control: The device’s central processing unit (CPU or microcontroller) is located on the PCB and is responsible for performing calculations, controlling operations, and making decisions based on received signals and data.
- Data Transmission: In devices that connect to the internet or other devices, the PCB’s communication interfaces (such as Wi-Fi, Bluetooth, Ethernet ports) are used for data transmission and communication.