Archecircuit Multilayer Power Energy PCB Decoding Board HASL Lead-free
Dimension: 236.50*215.00 mm
Layers: Multilayer
Plate thickness: 2.0 mm （Inner layer copper: 2Oz/ Outer layer copper: 2Oz )
Plate: FR-4
Surface finish: HASL Lead-free
Application: Power & Energy
| Layer Count | 1-32 Layers |
| Material | FR-4 (Tg 135 / Tg140 / Tg155 / Tg170/ As you required) Aluminum Rogers / PTFE Teflon |
| Surface Finishing | HASL/OSP/Immersion Gold(FR4) HASL(Aluminum) |
| Printed Wiring: | Pattern Plating |
| Max. Dimension | 660×475mm |
| Min. Dimension | 5×5mm |
| Finished board thickness: | 0.2mm-3.0mm |
| Thickness Tolerance: ( Thickness≥1.0mm) | ± 10% |
| Thickness Tolerance: ( Thickness<1.0mm) | ± 0.1mm |
| Finished Outer Layer Copper | Double sided: 1 oz/2 oz/3 oz/4 oz Multilayer: 1 oz/2 oz |
| Finished Inner Layer Copper | 0.5 oz/1 oz/2 oz |
| Drill Hole Size | Double sided: 0.20mm – 6.30mm Multilayer: 0.15mm-6.3mm |
| Drill Hole Size Tolerance | Pad Hole: +0.13/-0.08mm Pressure Welding Hole: ±0.05mm |
| Blind/Buried Vias | Don’t support |
| Min. Via Hole Size/Diameter | 1 & 2 Layer: 0.3mm(Via hole size) / 0.5mm(Via diameter) Multi-Layer: 0.15mm(Via hole size) / 0.25mm(Via diameter) Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size Preferred Min. Via hole size: 0.2mm |
| Min. Plated Slots | 0.35mm |
| Min. Non-Plated Slots | 0.65mm |
| Plated Half-hole | Hole Size: ≧0.15mm Pad to Board Edge：≧1mm Min. Size of Board: 10*10mm |
| Min. Trace width and spacing(1 oz) | 0.075/0.075mm (3mil/3mil) |
| Min. Trace width and Spacing(2 oz) | 0.16/0.16mm (6.5mil/6.5mil) |
| Min. Trace width and Spacing(2.5 oz) | 0.20/0.20mm (8mil/8mil) |
| Min. Trace width and Spacing(3.5 oz) | 0.25/0.25mm (10mil/10mil) |
| Min. Trace width and Spacing(4.5 oz) | 0.30/0.30mm (12mil/12mil) |
| Trace Tolerance | ±20% |
| Pad to Track | ≧0.1mm (≧0.09mm BGA) |
| Min. Annular Ring （1 oz) | Double sided: 0.25mm preffered (Limit 0.18mm) Multilayer: 0.20mm preffered (Limit 0.15mm) |
| Min. Annular Ring （No copper) | 0.45mm |
| BGA | Pad diameter:≥0.25mm Spacing between line to pad: ≥0.1mm (Multilayer: ≥0.09mm) |
| Solder mask Color | green,purple, red, yellow, blue, white, and black. |
| Solder mask Opening/ Expansion | 0.05mm |
| Solder mask ink Thickness | ≧10um |
| Min. Solder Bridge Width | Double sided: 0.10mm(green) 0.13mm(black/white) Multilayer： 0.08mm(green) 0.13mm(black/white) |
| Min. Line Width | ≧0.15mm |
| Min. Text Height | ≧1mm |
| Pad To Silkscreen | ≧0.15mm |
| Routing | Trace to Outline: ≧0.3mm Tolerance: ±0.2mm(Once) ±0.1mm(Twice) |
| V-Cut | Trace to Outline: ≧0.4mm Tolerance: ±0.4mm (Board Thickness ≧0.6mm) |
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